Mechanic Heat Air Desoldering Station For iPhone X-15 Pro Max

Mechanic Heat Air Constant Temperature Desoldering Preheating Platform:

Description:
The Mechanic Heat Air Desoldering Station is a professional-grade tool for repairing iPhone X to 15 Pro Max motherboards. Designed for tasks like layering, degumming, tin planting, lamination, delamination, reflow soldering, and desoldering, it offers precision and efficiency for mobile phone motherboard repairs.

Specifications:

• Name: Mechanic Heat Air Desoldering Station
• Input Voltage: AC100V/240V
• Output Power: 600W
• Size: 178 x 101 x 45mm
• Temperature Setting: 260℃
• Time Setting: 10s - 990s

Packing List  :

• Host
• Common Module
• Power Cord
• Box

Including Modules (Heating + Stencils):

1. iPhone X-11 Pro Max: Heating module + 5pcs reballing stencil
2. iPhone 12 Series: Heating module + 3pcs reballing stencil
3. iPhone 13 Series: Heating module + 4pcs reballing stencil
4. iPhone 14 Series: Heating module + 3pcs reballing stencil
5. iPhone 15 Series: Heating module + 2pcs reballing stencil

Key Features:

1. Comprehensive Repair Functions: Supports glue removal, tin planting, lamination, layering, reflow, desoldering, and soldering for mobile phone motherboards.
2. Intelligent Control: One-key intelligent separation/bonding ensures safety, preventing tin explosion.
3. Fast Heating:
   • 60 seconds: Quickly heats up.
   • 180 seconds: Completes layering tasks efficiently.
4. Safety Features:
   • Intelligent temperature control and high-temperature protection to prevent motherboard damage.
   • PTC heating core ensures rapid heating and efficient heat conduction.
5. 600W Peak Power: Delivers strong and consistent performance.
6. HD Display:
   • 2.5-inch HD display shows real-time temperature, countdown, and memory settings.
   • Three memory temperature presets for quick switching.
7. Effortless Operation:
   • Adjust temperature with a stepless dial.
   • Set time and temperature easily with intuitive controls.
   • Automatic cooling with buzzer prompts when the countdown ends.
8. Durable Design:
   • Double-sided heat dissipation for stability and safety.
   • High-temperature resistance ensures convenient and effective motherboard maintenance.
9. Expandable and Modular: Supports upgrades and additional modules for extended functionality.
10. Diagnostic Capabilities: Stores boot current fault data and provides curve analysis for troubleshooting.