[YCS-2S] Chip Glue Removal Heating Platform

Yang Changshun Chip Glue Removal Heating Platform 2S

The Yang Changshun Chip Glue Removal Heating Platform 2S is a professional tool designed for the efficient removal of glue from IC chips and hard drives during phone repairs. With its rapid heating capability, this tool ensures quick and safe glue removal, making it essential for delicate component repairs in mobile phones and other electronic devices.

Key Features:

• Fast Heating Technology: Heats up quickly to efficiently remove adhesive from IC chips and hard drives without damaging the components.
• Precision Temperature Control: Designed for precise and uniform heating, making it suitable for sensitive electronic parts.
• Durable Build: Made with high-quality materials for durability, ensuring long-term use in professional repair settings.
• Compact Design: Its compact size makes it easy to use and store, ideal for both repair shops and mobile technicians.

Applications:

• IC Chip Glue Removal
• Hard Drive Glue Removal
• Electronic Component Repairs

This heating platform is a must-have tool for technicians specializing in chip-level repairs and glue removal, ensuring safe and precise results every time.