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Cargue la imagen en el visor de la galería, Mechanic IX5 Ultra Universal Preheating Platform for Motherboard Repair
Cargue la imagen en el visor de la galería, Mechanic IX5 Ultra Universal Preheating Platform for Motherboard Repair
Cargue la imagen en el visor de la galería, Mechanic IX5 Ultra Universal Preheating Platform for Motherboard Repair
Cargue la imagen en el visor de la galería, Mechanic IX5 Ultra Universal Preheating Platform for Motherboard Repair
Cargue la imagen en el visor de la galería, Mechanic IX5 Ultra Universal Preheating Platform for Motherboard Repair
Cargue la imagen en el visor de la galería, Mechanic IX5 Ultra Universal Preheating Platform for Motherboard Repair
Cargue la imagen en el visor de la galería, Mechanic IX5 Ultra Universal Preheating Platform for Motherboard Repair

Mechanic IX5 Ultra Universal Preheating Platform for Motherboard Repair

Precio regular $74.00 NZD
Precio de venta $74.00 NZD Precio regular
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Mechanic IX 5 Ultra Universal Preheating Platform

Product Description:

The Mechanic IX 5 Ultra Universal Preheating Platform is a cutting-edge tool designed for efficient and uniform heating in mobile phone motherboard repairs. It eliminates the need for traditional air guns or soldering irons, offering an innovative solution for heating, layering, tinning, laminating, and degumming. Ideal for professionals, this preheating platform provides precise temperature control and uniform heat distribution, ensuring high-quality repairs for all sizes of phone motherboards.

Key Features:

  • Uniform Heating: Achieves consistent temperature across the entire platform, ensuring even heating without the need for an air gun or soldering iron.
  • Temperature Control: Freely adjustable temperature range from 20°C to 260°C, allowing you to tailor the heating process to your specific repair needs.
  • Compact & Lightweight: Small, portable design (8 x 8 x 5.7 cm) makes it easy to use in a variety of work environments.
  • Aluminum Alloy Panel: Durable, high-quality construction for long-lasting performance.
  • Versatile Applications: Supports motherboard delamination, lamination, and dot matrix repair, making it suitable for a wide range of repair tasks.
  • Supports All Phone Sizes: Compatible with all sizes of cell phone motherboards, providing flexibility for different models and brands.

Specifications:

  • Voltage: 110V / 220V
  • Preheating Temperature Range: 20°C ~ 260°C
  • Product Size: 8 x 8 x 5.7 cm (3.15 x 3.15 x 2.24 inches)

Packaging Details:

  • Weight (One Package): 0.43 kg (0.95 lb)
  • Package Size: 18.5 x 15 x 5 cm (7.28 x 5.91 x 1.97 inches)
  • Quantity per Carton: 40 units
  • Carton Weight: 17.00 kg (37.48 lb)
  • Carton Size: 52 x 39 x 32 cm (20.47 x 15.35 x 12.6 inches)

Applications:

  • Ideal for use in mobile phone repair shops, this preheating platform is perfect for delicate motherboard repairs, ensuring efficiency and accuracy in processes like delamination, lamination, and dot matrix repair.