[RL-101H] Sunshine Relife Main Board Middle Layer Layered Special Blade For Mobile Phone Motherboard Chip Repair Bevel Layered Blade

1.The first research and development of the blade design structure completely solves the problem that the middle layer has been troubled by the maintenance master, and the tool is easy to pry and damage the components.

2.It not only ensures the high hardness of the blade, but more importantly, it has the high toughness, high elasticity, and zero damage to the motherboard chip necessary for mobile phone repair, so that the mobile phone chip can be better protected.

3.The blade is hardened, the cutting edge is ultra-thin, and the design of the cutting edge of the blade is more in line with the requirements of use.